HIGHLIGHTS of MEDESO's ANSYS Newsletter 2006-04-28 *ANSYS v10 Service pack 1 released *ANSYS acquires Fluent *ANSYS acquires Harvard Thermal ==================================================================== COMPANY NEWS *ANSYS Signs Definitive Agreement to Acquire Fluent Under the terms of the merger agreement, ANSYS will issue 6,000,000 shares of its common stock and pay approximately $300 million in net cash to acquire Fluent, subject to certain adjustments at closing. The transaction is valued at approximately $565 million based on the $44.11 per share closing price of ANSYS common stock on February 15, 2006. ANSYS will use a combination of existing cash and approximately $200 million from committed bank financing to fund the transaction. The acquisition of Fluent is expected to enhance the breadth, functionality, usability and interoperability of the ANSYS portfolio of simulation solutions. This will increase operational efficiency and lower design and engineering costs for customers, and accelerate development and delivery of new and innovative products to the marketplace. The combination of Fluent's and ANSYS' software products and services is expected to give ANSYS one of the most complete, independent engineering simulation software offerings in the industry, reaffirming and strengthening ANSYS' commitment to open interface and flexible simulation solutions that are primarily driven by customer demand and choice. With over 40 direct sales offices and 17 development centers, on three continents, the combined company will employ approximately 1,350 people. "We are very excited about the industry leading technologies that Fluent adds to ANSYS' simulation capabilities," said James Cashman, President and CEO of ANSYS. "Both companies have a strong commitment to their customers and employees and share a passion for the development of innovative products and services and a history of world-class execution. This combination will strengthen these values and will allow us to better serve our customers by accelerating delivery of comprehensive, customer-driven engineering simulation solutions and by enabling us to provide high quality support throughout the world." ... SOURCE : ANSYS, Inc. For complete press release se `News´ at www.ansys.com. *ANSYS Acquires Harvard Thermal ANSYS has acquired Harvard Thermal, a leading provider of software tools for thermal design in the electronics industry. It encompasses the products TASPCB and PTD. TASPCB is a tool aimed at thermal analysis of circuit boards. It contains a CFD solver and can take into account cooling due to flowing air as well as heating from electric currents. PTD is a tool for detailed thermal analysis on a component level. * MEDESO wins ANSYS Dominator of the Year award At the yearly ANSYS Sales Conference in Pittsburgh, Medeso received the prestigious "ANSYS Dominator Award 2005", as best Ansys re-seller world-wide. The award was given for best achievement and for recognition by customers and ANSYS colleagues. ==================================================================== PRODUCT NEWS * Service pack 1 for ANSYS 10.0 has been released and can be downloaded from the ANSYS Customer Portal. The service packs are full installations. ANSYS recommends uninstalling the current v10 and then installing v10 SP1. As part of this service pack, there are for the first time versions for Windows IA-64 (ANSYS Environment) and for Windows XP x64 EM64T and Opteron (ANSYS Environment and ANSYS Workbench). ==================================================================== CLASS3 ERROR REPORTS AND QA NOTICES 2005-24: EMAG FORCES TORQUE 2005-25: *GET/SOLUTION AVERAGED NODAL RESULTS 2005-26: PLNSOL USUM POWERGRAPHICS TRANSIENT RESULTS 2005-27: POST1 LAYER,FCMAX FAILURE CRITERIA 2006-01: PCG SOLVER CONSTRAINT EQUATIONS 2006-02: CORIOLIS FORCE ROTATING REFERENCE FRAME OMEGA CMOMEGA 2006-03: MODE SUPERPOSITION TRANSIENT UNSYMMETRIC MATRICES ACCELERATION QR DAMPED EIGENSOLVER 2006-04: DATABASE RESUME OMEGA CENTRIFUGAL FORCE 2006-05: RADIATION, PARALLEL, REFLECTIVE 2006-06: PCG MSAVE SOLID95 WB2005-08: PROBE TOOL QA-WB2006-01: COMMANDS OUTPUT SEARCH PREFIX WB2006-01: PARAMETERS RESUME UNITS WB2006-02: ELECTROMAGNETICS CURRENT DIRECTION WB2006-03: SOLUTION STATE MATERIAL DATABASE CONFLICT WB=Workbench, QA=Quality Assurance The error reports and the QA notes are available at the Customer Area at http://www.ansys.com/ This is a password protected area; please contact your ANSYS Reseller. ==================================================================== UPCOMING TRAINING COURSES We offer scheduled training courses in Västerås,Sweden, Aarhus, Denmark and Oslo, Norway. V: 10-12 May Multiphysics Simulation for MEMS V: 15-16 May DesignModeler V: 17-19 May + 1-2 Jun Introduction to ANSYS V: 22-23 May + 7-8 Jun Stress Analysis with DesignSpace V: 9 Jun ANSYS Workbench - Simulation Structural Nonlinearities V: 12-13 Jun Dynamics V: 14-15 Jun Efficient Contact Analysis with ANSYS V: 19-22 Jun Introduction to CFX Location: A=Aarhus, O=Oslo, V=Västerås See http://www.medeso.se/training/ansys.html for the complete training schedule. ==================================================================== UPCOMING EVENTS * Workbench User meeting in Västerås On May 16th you are welcome to a day loaded with information about ANSYS Workbench. Among other things we are presenting use of contacts and assemblies: what types of contacts you should use in your analysis, when to use nonlinear contact and how to get the analysis to converge. These are a few topics we are going to present during the day. The meeting will be at our office in Västerås, for further information please contact Jonas Larsson via email; jonas.larsson@medeso.se. * MSW 2006 in Västerås On May 9th-10th, the Micro Structure Workshop 2006 is held in Västerås. This is a forum for those interested in MEMS and MST. For more information, visit http://www.minst.nu/msw2006/ * Ansys CFX Roadshow During May 16th-19th, Medeso will be showing Ansys CFX in the following cities: May 16: Aarhus May 17: Copenhagen May 18: Lund May 19: Göteborg To register, go to this page: http://www.medeso.se/forms/registration_roadshow.html * NAFEMS Prediction and Modelling of Failure Using FEA Om May 31st-June 1st in Copenhagen, Denmark, NAFEMS will be holding this seminar. For more information, visit http://www.nafems.org/events/nafems/2006/Page12/ =================================================================== TIPS AND TRICKS +++++++++++++ If you have a large assembly with many contacts in Workbench, it can take a very long time to check the individual status of them all. A quick and simple test to see where there is and isn't contact is to run a thermal analysis: Insert a new Environment where you set: - A boundary condition Temperature of (for instance) 100 degrees at some surface in a corner of the assembly - A boundary condition Temperature of 200 degrees at an opposite corner in the assembly. - A temperature result under Solution Don't include any structural loads or results in this environment. Run the analysis (thermal analysis solves much faster than structural) and check that the calculated temperature varies smoothly from 100 degrees to 200. If there is a sudden jump in temperature between two adjacent parts, they are not in contact. If a part gets a calculated temperature of 0 degrees, it's not in contact with the rest of the assembly. +++++++++++++ If you set up a model in Ansys Workbench and wish to export it to Ansys Classic and continue to work there, you should, in Workbench, insert some result object under Solution. You do not need to perform a solution but at least one result object is needed in order for Named Selections to be transferred as components and for Commands Objects to be executed. ==================================================================== MEDESO Group Medeso AB has been marketing and selling leading software for mechanical analysis since 1987 and has been a full line ANSYS reseller since early 1998. We work with stress analysis, mainly the Finite Element Method (FEM), motion analysis, computational fluid dynamics and different types of piping and pressure vessel analysis. A few years ago we expanded our field of competence to low and high frequency electromagnetics. Medeso Oy was started 2001 to strengthen Medeso's local presence and is led by our office manager Pekka Mölkänen. Approximately a year ago, Medeso AB set up an office in Sandvika Norway, to serve our Norwegian and Danish customers. Sweden MEDESO AB (HQ) Phone: +46 21 15 03 90 Lysgränd 1 Fax: +46 21 15 03 99 SE-721 30 Västerås E-mail: info@medeso.se SWEDEN URL: www.medeso.se MEDESO AB (Växjö office) Phone: +46 21 15 03 90 PG Vejdes väg 15 Fax: +46 21 15 03 99 SE-351 96 VÄXJÖ E-mail: info@medeso.se SWEDEN URL: www.medeso.se Norway and Denmark Medeso AB Phone: +47 67 56 94 40 Hamangskogen 60 Fax: +47 67 56 94 41 NO-1338 Sandvika Email: erling.wiig@medeso.no NORWAY URL: www.medeso.no Finland MEDESO OY Phone: +358 17 511 090 Microkatu 1 Fax: +358 17 511 091 FIN-702 10 Kuopio E-mail: pekka.molkanen@medeso.fi FINLAND URL: www.medeso.fi THE NEWSLETTER Previous issues of this newsletter are archived on http://www.medeso.se/support/ansys.html You can subscribe and unsubscribe to this list by sending an e-mail to info@medeso.se ==================================================================== All product names and trademarks are the property of their respective owners. Copyright © 2005 MEDESO AB, All Rights Reserved.